Invention Grant
- Patent Title: Determining endpoint in a substrate process
- Patent Title (中): 确定底物过程中的终点
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Application No.: US12688840Application Date: 2010-01-15
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Publication No.: US07808651B2Publication Date: 2010-10-05
- Inventor: Lei Lian , Matthew F Davis
- Applicant: Lei Lian , Matthew F Davis
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Janah & Associates, P.C.
- Main IPC: G01B11/02
- IPC: G01B11/02

Abstract:
An endpoint detection system for detecting an endpoint of a process comprises a polychromatic light source which emits polychromatic light. The light is reflected from a substrate. A light wavelength selector receives the reflected polychromatic light and determines a wavelength of light at which a local intensity of the reflected light is maximized during the process. In one version, the wavelength selector comprises a diffraction grating to generate a plurality of light beams having different wavelengths from the reflected polychromatic light and a light detector to receive the light beams having different wavelengths and generate an intensity signal trace of the intensity of each wavelength of the polychromatic reflected light.
Public/Granted literature
- US20100133232A1 DETERMINING ENDPOINT IN A SUBSTRATE PROCESS Public/Granted day:2010-06-03
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