Invention Grant
US07808341B2 Broadband RF connector interconnect for multilayer electronic packages
有权
用于多层电子封装的宽带RF连接器互连
- Patent Title: Broadband RF connector interconnect for multilayer electronic packages
- Patent Title (中): 用于多层电子封装的宽带RF连接器互连
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Application No.: US11709080Application Date: 2007-02-21
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Publication No.: US07808341B2Publication Date: 2010-10-05
- Inventor: Gerardo Aguirre
- Applicant: Gerardo Aguirre
- Applicant Address: US CA San Diego
- Assignee: Kyocera America, Inc.
- Current Assignee: Kyocera America, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Hogan Lovells US LLP
- Main IPC: H01P5/02
- IPC: H01P5/02

Abstract:
A coaxial transition arrangement including a coaxial connector for connecting a coaxial cable to a multilayer package has an improved coaxial connector for accomplishing impedance matching and providing improved broadband performance. Impedance matching is provided by a metal disk structure comprising a plurality of metal disks mounted on a center conductor pin of the coaxial connector. The disks are mounted in spaced-apart relation on the center conductor pin and have different radiuses which decrease with increasing distance from the base of the center conductor pin. The coaxial connector has a shroud which is configured to accommodate the metal disk structure therein, as does the ring of ground vias forming a part of the multilayer package.
Public/Granted literature
- US20080200068A1 Broadband RF connector interconnect for multilayer electronic packages Public/Granted day:2008-08-21
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