Invention Grant
- Patent Title: Integrated circuit having pads and input/output (I/O) cells
- Patent Title (中): 集成电路具有焊盘和输入/输出(I / O)单元
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Application No.: US11383653Application Date: 2006-05-16
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Publication No.: US07808117B2Publication Date: 2010-10-05
- Inventor: Nhat D. Vo , Tu-Anh N. Tran , Burton J. Carpenter , Dae Y. Hong , James W. Miller , Kendall D. Phillips
- Applicant: Nhat D. Vo , Tu-Anh N. Tran , Burton J. Carpenter , Dae Y. Hong , James W. Miller , Kendall D. Phillips
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Susan C. Hill; Joanna G. Chiu
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A pad (20) is electrically connected to a first I/O cell (14) while also physically overlying active circuitry of a second I/O cell (16). Note that although the pad (20) overlies the second I/O cell (16), the pad (20) is not electrically connected to the I/O cell (16). Such a pattern may be replicated in any desired manner so that the I/O cells (e.g. 300-310) may have a finer pitch than the corresponding pads (320-324 and 330-335). In addition, the size of the pads may be increased (e.g. pad 131 may be bigger than pad 130) while the width “c” of the I/O cells (132-135) does not have to be increased. Such a pattern (e.g. 500) may be arranged so that the area required in one or more dimensions may be minimized.
Public/Granted literature
- US20070267755A1 INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS Public/Granted day:2007-11-22
Information query
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