Invention Grant
US07808113B2 Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion
有权
具有工件粘合促进剂层的倒装芯片半导体器件用于改善底部填充粘附
- Patent Title: Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion
- Patent Title (中): 具有工件粘合促进剂层的倒装芯片半导体器件用于改善底部填充粘附
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Application No.: US12171026Application Date: 2008-07-10
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Publication No.: US07808113B2Publication Date: 2010-10-05
- Inventor: Bernardo Gallegos
- Applicant: Bernardo Gallegos
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
A semiconductor device assembly (200) includes a workpiece (205) having a surface including a die attach region corresponding to regions under an integrated circuit (IC) die 210. The die attach region of workpiece (205) includes non-noble metal surfaces (215) and a plurality of flip chip (PC) pads at pad locations (214). A solder mask layer (207) is on a surface of the workpiece (205) outside the die attach region. The non-noble metal surfaces (215) in the die attach region include an adhesion promoter layer (221), wherein the adhesion promoter layer 221 is absent from the plurality of PC pads (214). An integrated circuit (IC) die (210) having a plurality of bumps (211) bonded in a flip chip arrangement to the workpiece (205). An underfill material (232) fills a space between the bumped IC die (210) and the workpiece (205).
Public/Granted literature
- US20100007032A1 FLIP CHIP SEMICONDUCTOR DEVICE HAVING WORKPIECE ADHESION PROMOTER LAYER FOR IMPROVED UNDERFILL ADHESION Public/Granted day:2010-01-14
Information query
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