Provided is a semiconductor package, and in particular a semiconductor package which is capable of electrically connecting to the outside without a lead. The leadless package includes a plurality of lower conducting layer patterns disposed separately from one another; an insulating layer pattern on the lower conducting layer patterns; a plurality of upper conducting layer patterns disposed separately from one another, on the insulating layer pattern; at least one semiconductor chip disposed on the upper conducting layer patterns; hole patterns formed through the upper conducting layer patterns and the insulating layer pattern, so that a part of the top surface of the lower conducting layer patterns are exposed; and electrical connectors electrically connecting: the at least one semiconductor chip and the upper conducting layer patterns; the upper conducting layer patterns and the lower conducting layer patterns exposed by the hole patterns; and the at least one semiconductor chip and the lower conducting layer patterns exposed by the hole patterns.