Invention Grant
- Patent Title: Semiconductor package and production method thereof, and semiconductor device
- Patent Title (中): 半导体封装及其制造方法以及半导体器件
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Application No.: US11659468Application Date: 2005-05-12
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Publication No.: US07808096B2Publication Date: 2010-10-05
- Inventor: Hisaho Inao , Tatsuya Hirano , Katsutoshi Shimizu
- Applicant: Hisaho Inao , Tatsuya Hirano , Katsutoshi Shimizu
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2004-230712 20040806
- International Application: PCT/JP2005/008697 WO 20050512
- International Announcement: WO2006/013664 WO 20060209
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A semiconductor package production method includes the step of die-cutting part of a lead side portion of a seal formed by molding and dam bars using a pedestal and punch. The pedestal has an outer surface at a position retreating from a side surface of an upper seal portion as far as possible and an inner surface generally near a side surface of a lower seal portion. Width Wa of the upper surface of the upper surface of the pedestal is smaller than the overhang size of the upper seal portion. Tip end region Ra of the lead side portion which is present right under the overhang portion of the upper seal portion has a slanted surface Fa1which is sloped inwardly from top to bottom.
Public/Granted literature
- US20080132002A1 Semiconductor Package and Production Method Thereof, and Semiconductor Device Public/Granted day:2008-06-05
Information query
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