A stacked structure of semiconductor chips includes plural stacked semiconductor chips and plural tabular holding members which hold the respective semiconductor chips. At least two holding members among the holding members are arranged in places at ends of the semiconductor chips where inner side facets of the holding members are opposed to each other, at least one semiconductor chip of the two semiconductor chips held by the two holding members, respectively, is held by only one holding member of the holding members at one end of the semiconductor chip, and all or a part of the one semiconductor chip is arranged in the largest space positioned in an inner side of the inner side facet of the other holding member of the holding members, the largest space being formed by a surface including the one surface of the other holding member, a surface including the other surface of the other holding member, and a surface including a surface of the other semiconductor chip held by the other holding member, the other semiconductor chip being closer to the other holding member.