Invention Grant
US07808082B2 Structure and method for dual surface orientations for CMOS transistors
失效
用于CMOS晶体管的双面取向的结构和方法
- Patent Title: Structure and method for dual surface orientations for CMOS transistors
- Patent Title (中): 用于CMOS晶体管的双面取向的结构和方法
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Application No.: US11559571Application Date: 2006-11-14
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Publication No.: US07808082B2Publication Date: 2010-10-05
- Inventor: Haining Yang , Thomas W. Dyer , Keith Kwong Hon Wong , Chih-Chao Yang
- Applicant: Haining Yang , Thomas W. Dyer , Keith Kwong Hon Wong , Chih-Chao Yang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: H01L21/335
- IPC: H01L21/335

Abstract:
The present invention provides structures and methods for providing facets with different crystallographic orientations than what a semiconductor substrate normally provides. By masking a portion of a semiconductor surface and exposing the rest to an anisotripic etch process that preferentially etches a set of crystallographic planes faster than others, new facets with different surface orientations than the substrate orientation are formed on the semiconductor substrate. Alternatively, selective epitaxy may be utilized to generate new facets. The facets thus formed are joined to form a lambda shaped profile in a cross-section. The electrical properties of the new facets, specifically, the enhanced carrier mobility, are utilized to enhance the performance of transistors. In a transistor with a channel on the facets that are joined to form a lambda shaped profile, the current flows in the direction of the ridge joining the facets avoiding any inflection in the direction of the current.
Public/Granted literature
- US20080111162A1 STRUCTURE AND METHOD FOR DUAL SURFACE ORIENTATIONS FOR CMOS TRANSISTORS Public/Granted day:2008-05-15
Information query
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