Invention Grant
- Patent Title: Electronic component manufacturing method and electronic component
- Patent Title (中): 电子元件制造方法和电子元器件
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Application No.: US11595913Application Date: 2006-11-13
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Publication No.: US07808030B2Publication Date: 2010-10-05
- Inventor: Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
- Applicant: Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2005-340121 20051125
- Main IPC: H01L21/76
- IPC: H01L21/76
Abstract:
The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.
Public/Granted literature
- US20070122992A1 Electronic component manufacturing method and electronic component Public/Granted day:2007-05-31
Information query
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