Invention Grant
- Patent Title: Polyamide resin composition
- Patent Title (中): 聚酰胺树脂组合物
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Application No.: US11995944Application Date: 2006-07-20
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Publication No.: US07807742B2Publication Date: 2010-10-05
- Inventor: Kazumi Tanaka , Minoru Kikuchi
- Applicant: Kazumi Tanaka , Minoru Kikuchi
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2005-212622 20050722
- International Application: PCT/JP2006/314384 WO 20060720
- International Announcement: WO2007/010984 WO 20070125
- Main IPC: C08K3/32
- IPC: C08K3/32 ; C08K5/521 ; C08K5/524

Abstract:
A polyamide resin composition comprising a polyamide (X) having a diamine constituent unit which is mainly composed of a m-xylylenediamine unit and a dicarboxylic acid constituent unit which is mainly composed of an adipic acid unit; and specific amounts of a phosphorus acid antioxidant and alkaline component. The polyamide (X) is characterized by a specific range of terminal-group concentration balance and a specific amino-group reaction rate. This composition can simultaneously achieve inhabitation of yellow discoloration and reduction of number of gels or fish eyes.
Public/Granted literature
- US20100120961A1 POLYAMIDE RESIN COMPOSITION Public/Granted day:2010-05-13
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