Invention Grant
- Patent Title: Thermosetting solution composition and prepreg
- Patent Title (中): 热固性溶液组合物和预浸料
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Application No.: US12178855Application Date: 2008-07-24
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Publication No.: US07807014B2Publication Date: 2010-10-05
- Inventor: Hiroaki Yamaguchi , Fumio Aoki
- Applicant: Hiroaki Yamaguchi , Fumio Aoki
- Applicant Address: JP Ubi-shi, Yamaguchi
- Assignee: UBI Industries, Ltd.
- Current Assignee: UBI Industries, Ltd.
- Current Assignee Address: JP Ubi-shi, Yamaguchi
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2005-160585 20050531; JP2005-348407 20051201; JP2006-116076 20060419
- Main IPC: C04B37/00
- IPC: C04B37/00 ; B29C65/00 ; B32B37/00 ; C08J5/00 ; C08L77/00 ; D21H17/55 ; C08G69/26

Abstract:
A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3′,4′-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2′,3,3′-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.
Public/Granted literature
- US20090036601A1 THERMOSETTING SOLUTION COMPOSITION AND PREPREG Public/Granted day:2009-02-05
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