Invention Grant
US07806974B2 Highly conductive ink composition and method for fabricating a metal conductive pattern
有权
高导电性油墨组合物和金属导电图案的制造方法
- Patent Title: Highly conductive ink composition and method for fabricating a metal conductive pattern
- Patent Title (中): 高导电性油墨组合物和金属导电图案的制造方法
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Application No.: US11439242Application Date: 2006-05-24
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Publication No.: US07806974B2Publication Date: 2010-10-05
- Inventor: Gue-Wuu Hwang , Bao-Tsan Ko , Yi-Shin Lin
- Applicant: Gue-Wuu Hwang , Bao-Tsan Ko , Yi-Shin Lin
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW94147653A 20051230
- Main IPC: C09D11/00
- IPC: C09D11/00
Abstract:
A viscosity controllable highly conductive ink composition. The highly conductive ink composition comprises an organic solvent, nanoscale metal particles or metallo-organic decomposition compounds, and a thermally decomposable organic polymer. Specifically, since the thermally decomposable polymer can increase the viscosity of the highly conductive ink composition and be removed by subsequent thermal treatment, so as to decrease the impact on conductivity by organic polymer. Therefore, a viscosity-controllable conductive ink composition is obtained.
Public/Granted literature
- US20070154644A1 Highly conductive ink composition and method for fabricating a metal conductive pattern Public/Granted day:2007-07-05
Information query
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