Invention Grant
- Patent Title: Apparatus and method for cutting using a liquid fluid jet
- Patent Title (中): 使用液体流体射流进行切割的装置和方法
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Application No.: US11960977Application Date: 2007-12-20
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Publication No.: US07806750B2Publication Date: 2010-10-05
- Inventor: Jack B. Shaw
- Applicant: Jack B. Shaw
- Agency: Banner & Witcoff, Ltd.
- Main IPC: B24C3/06
- IPC: B24C3/06

Abstract:
An apparatus and method for cutting a material using a water jet. A central shaft is mounted so as to extend outward from a material to be cut. A support member is mounted on the central shaft so as to extend transversely therefrom. At least one water jet cutting head is mounted on the support member so as to be translatable therealong. In addition, the at least one water jet cutting head is mounted so as to be rotatable about the central shaft. By controlling the translatory and rotational motion of the at least one water jet cutting head (for example, using computer numerical control or other computer control), a desired cut pattern can be followed with respect to the material being cut.
Public/Granted literature
- US20080092703A1 Apparatus And Method For Cutting Using A Liquid Fluid Jet Public/Granted day:2008-04-24
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