Invention Grant
- Patent Title: Method and apparatus for removing known good die
- Patent Title (中): 去除已知好模具的方法和装置
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Application No.: US11551754Application Date: 2006-10-23
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Publication No.: US07806312B2Publication Date: 2010-10-05
- Inventor: Lannie R. Bolde , James H. Covell , Mark W. Kapfhammer
- Applicant: Lannie R. Bolde , James H. Covell , Mark W. Kapfhammer
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb I.P. Law Firm, LLC
- Main IPC: B23K1/018
- IPC: B23K1/018

Abstract:
A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
Public/Granted literature
- US20070057024A1 METHOD AND APPARATUS FOR REMOVING KNOWN GOOD DIE Public/Granted day:2007-03-15
Information query
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