Invention Grant
- Patent Title: Gas sensor housing for use in high temperature gas environments
- Patent Title (中): 用于高温气体环境的气体传感器外壳
-
Application No.: US11729129Application Date: 2007-03-27
-
Publication No.: US07805992B2Publication Date: 2010-10-05
- Inventor: Palani Thanigachalam , Saju Ramachandran , Ramsesh Anilkumar
- Applicant: Palani Thanigachalam , Saju Ramachandran , Ramsesh Anilkumar
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Main IPC: G01D11/24
- IPC: G01D11/24

Abstract:
An apparatus and method for packaging and operating a gas sensor for use in high temperature gas environments. A gas sensor can be configured, which includes a sensor element and a housing in which the sensor element is located. A parallel gas path can be configured form said housing, wherein said parallel gas path is based on the natural differential pressure with respect to the velocity of said gas. The parallel gas path is preferably vertical to provide a sufficient friction to soot particles compared to the gas, such that when a partial quantity of said gas reaches said sensor element, said soot particles are avoided by said sensor element.
Public/Granted literature
- US20080236246A1 Gas sensor housing for use in high temperature gas environments Public/Granted day:2008-10-02
Information query