Invention Grant
- Patent Title: Using refrigeration and heat pipe for electronics cooling applications
- Patent Title (中): 使用制冷和热管进行电子冷却应用
-
Application No.: US11618795Application Date: 2006-12-30
-
Publication No.: US07805955B2Publication Date: 2010-10-05
- Inventor: Rajiv K. Mongia
- Applicant: Rajiv K. Mongia
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: F25D23/12
- IPC: F25D23/12
Abstract:
A cooling system includes a heat pipe and a refrigerator. A combination at least one or more of the heat pipe and the refrigerator is used to cool an electronic component capable of generating heat. Depending on the cooling requirement, a different cooling combination may be used.
Public/Granted literature
- US20080156003A1 USING REFRIGERATION AND HEAT PIPE FOR ELECTRONICS COOLING APPLICATIONS Public/Granted day:2008-07-03
Information query
IPC分类:
