Invention Grant
- Patent Title: Enclosure including an electrical module
- Patent Title (中): 外壳包括电气模块
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Application No.: US12217301Application Date: 2008-07-02
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Publication No.: US07791891B2Publication Date: 2010-09-07
- Inventor: Christian Ohl , Frieder Haag , Juergen Kurle , Ingbert Gerngross
- Applicant: Christian Ohl , Frieder Haag , Juergen Kurle , Ingbert Gerngross
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007031562 20070706
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected.
Public/Granted literature
- US20090027861A1 Enclosure including an electrical module Public/Granted day:2009-01-29
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