Invention Grant
- Patent Title: Measurement method, exposure method, and device manufacturing method
- Patent Title (中): 测量方法,曝光方法和器件制造方法
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Application No.: US11576379Application Date: 2005-09-30
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Publication No.: US07791718B2Publication Date: 2010-09-07
- Inventor: Tsuneyuki Hagiwara
- Applicant: Tsuneyuki Hagiwara
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-287178 20040930
- International Application: PCT/JP2005/018084 WO 20050930
- International Announcement: WO2006/035925 WO 20060406
- Main IPC: G01B9/00
- IPC: G01B9/00

Abstract:
Light is irradiated on a light-shielding pattern on an object surface side of a projection optical system, and light intensity distribution of the light having passed through the projection optical system and slits is detected while slits of an aerial image measuring unit on the image plane side of the projection optical system are moved within a plane perpendicular to the optical axis of the projection optical system, The information concerning the flare of the projection optical system is computed from the light intensity distribution, so that the influence of resist coated on a wafer used in a conventional exposing method can be eliminated, and highly accurate measurement of information concerning the flare can be realized. Further, measurement of information concerning the flare can be performed in a short time comparing to the exposing method because development process or the like of the wafer is not necessary.
Public/Granted literature
- US20080068595A1 Measurement Method, Exposure Method, and Device Manufacturing Method Public/Granted day:2008-03-20
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