Invention Grant
US07791396B2 Semiconductor integrated circuit and semiconductor package module having the same
有权
具有相同的半导体集成电路和半导体封装模块
- Patent Title: Semiconductor integrated circuit and semiconductor package module having the same
- Patent Title (中): 具有相同的半导体集成电路和半导体封装模块
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Application No.: US11822268Application Date: 2007-07-03
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Publication No.: US07791396B2Publication Date: 2010-09-07
- Inventor: Young-Ju Kim , Kwan-Weon Kim
- Applicant: Young-Ju Kim , Kwan-Weon Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Venable LLP
- Agent Jeffri A. Kaminski
- Priority: KR10-2007-0024082 20070312
- Main IPC: H03L5/00
- IPC: H03L5/00

Abstract:
A semiconductor integrated circuit includes a first clock pin controller that receives a mirror function signal and a test mode signal to generate a first input buffer control signal in response to the mirror function signal in a normal mode. A second clock pin controller receives the mirror function signal and the test mode signal to generate a second input buffer control signal, which is an inverted signal of the first input buffer control signal, in response to the mirror function signal in the normal mode. An input buffer unit generates output signals of first and second pins in response to the first input buffer control signal and the second input buffer control signal, respectively.
Public/Granted literature
- US20080225497A1 Semiconductor integrated circuit and semiconductor package module having the same Public/Granted day:2008-09-18
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