Invention Grant
- Patent Title: Hybrid mounted device and method of manufacturing the same
- Patent Title (中): 混合安装装置及其制造方法
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Application No.: US11641018Application Date: 2006-12-19
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Publication No.: US07791212B2Publication Date: 2010-09-07
- Inventor: Morio Takahashi , Hiroyuki Yamazaki , Yukari Deki
- Applicant: Morio Takahashi , Hiroyuki Yamazaki , Yukari Deki
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2005-366533 20051220
- Main IPC: H01L21/544
- IPC: H01L21/544

Abstract:
There is provided a hybrid mounted device that includes a element such as semiconductor laser diode (LD), and a board such as a silicon platform having formed thereon an optical waveguide. The LD is mounted to the silicon platform, and is optically coupled to the optical waveguide. The mounting position of the LD is determined by positioning first alignment marks formed on the board and second alignment marks formed on the LD. In this configuration, initial positional deviation amount measuring marks that can measure the initial positional deviation amount of the first alignment marks themselves are formed on the board. The mounting position of the is corrected to a position where the second alignment marks are shifted with respect to the first alignment marks according to the initial positional deviation amount measured from the initial positional deviation amount measuring marks.
Public/Granted literature
- US20070170603A1 Hybrid mounted device and method of manufacturing the same Public/Granted day:2007-07-26
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