Invention Grant
- Patent Title: Power semiconductor arrangement
- Patent Title (中): 功率半导体布置
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Application No.: US11862677Application Date: 2007-09-27
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Publication No.: US07791208B2Publication Date: 2010-09-07
- Inventor: Reinhold Bayerer
- Applicant: Reinhold Bayerer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
A power semiconductor arrangement is provided that includes a power semiconductor chip being electrically connected to a set of plug-like elements with at least two plug-like elements and further including a sheet metal strip line including a set of openings receiving the first set of plug-like elements, where the set of openings in the sheet metal strip line and the set of plug-like elements establish a press fit connection.
Public/Granted literature
- US20090085219A1 POWER SEMICONDUCTOR ARRANGEMENT Public/Granted day:2009-04-02
Information query
IPC分类:
