Invention Grant
- Patent Title: Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
- Patent Title (中): 配线基板，使用布线基板的半导体装置及其制造方法
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Application No.: US11542261Application Date: 2006-10-04
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Publication No.: US07791186B2Publication Date: 2010-09-07
- Inventor: Katsumi Kikuchi , Shintaro Yamamichi , Yoichiro Kurita , Koji Soejima
- Applicant: Katsumi Kikuchi , Shintaro Yamamichi , Yoichiro Kurita , Koji Soejima
- Applicant Address: JP Tokyo JP Kanagawa
- Assignee: NEC Corporation,NEC Electronics Corporation
- Current Assignee: NEC Corporation,NEC Electronics Corporation
- Current Assignee Address: JP Tokyo JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-297811 20051012
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.
Public/Granted literature
- US20070080439A1 Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Public/Granted day:2007-04-12
Information query
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