Invention Grant
- Patent Title: Methods and apparatus for interconnecting a ball grid array to a printed circuit board
- Patent Title (中): 将球栅阵列与印刷电路板互连的方法和装置
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Application No.: US11116066Application Date: 2005-04-27
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Publication No.: US07790987B2Publication Date: 2010-09-07
- Inventor: Eiji Kasahara , Hiroshi Katoh
- Applicant: Eiji Kasahara , Hiroshi Katoh
- Applicant Address: JP Tokyo
- Assignee: Sony Computer Entertainment Inc.
- Current Assignee: Sony Computer Entertainment Inc.
- Current Assignee Address: JP Tokyo
- Agency: Gibson & Dernier LLP
- Agent Matthew B. Dernier, Esq.
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
Methods and apparatus provide for connecting an integrated circuit having a ball grid array to a printed circuit board having a matrix of contact pads for electrical connection to the ball grid array.
Public/Granted literature
- US20060243480A1 Methods and apparatus for interconnecting a ball grid array to a printed circuit board Public/Granted day:2006-11-02
Information query
