Invention Grant
- Patent Title: Electronic component packaging
- Patent Title (中): 电子元件包装
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Application No.: US11459187Application Date: 2006-07-21
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Publication No.: US07790615B2Publication Date: 2010-09-07
- Inventor: Bernard Diem
- Applicant: Bernard Diem
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0552282 20050722
- Main IPC: H01L21/14
- IPC: H01L21/14 ; H01L27/08 ; H01L21/465 ; H01L21/479
Abstract:
The invention relates to a method to seal a cavity, comprising a hole (6), comprising: the deposition on at least part of the cover, or an electrically conductive material (4, 5), the conveyance of part of this material by electro-migration into the hole (6) to form a plug (20).
Public/Granted literature
- US20070077675A1 ELECTRONIC COMPONENT PACKAGING Public/Granted day:2007-04-05
Information query
IPC分类:
