Invention Grant
- Patent Title: Dicing method using volatile protective agent
- Patent Title (中): 使用挥发性保护剂的切片方法
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Application No.: US11848423Application Date: 2007-08-31
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Publication No.: US07790578B2Publication Date: 2010-09-07
- Inventor: Toshikazu Furui
- Applicant: Toshikazu Furui
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2006-323006 20061130
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/78
Abstract:
Prior to dicing, a volatile protective agent is applied to at least the face of the substrate in which the devices are fabricated. Then the devices are separated by dicing. After dicing, the surface of the volatile protective agent is cleaned, and then the volatile protective agent is evaporated.
Public/Granted literature
- US20080132037A1 DEVICE MANUFACTURING METHOD AND DICING METHOD Public/Granted day:2008-06-05
Information query
IPC分类:
