Invention Grant
- Patent Title: Method of manufacturing thin film transistor substrate
- Patent Title (中): 制造薄膜晶体管基板的方法
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Application No.: US12324231Application Date: 2008-11-26
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Publication No.: US07790532B2Publication Date: 2010-09-07
- Inventor: Jae-Hyuk Chang , Kyu-Young Kim
- Applicant: Jae-Hyuk Chang , Kyu-Young Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2008-0013945 20080215
- Main IPC: H01L21/84
- IPC: H01L21/84

Abstract:
In a method of manufacturing a thin film transistor substrate, a gate line and a gate electrode are formed on a substrate. A gate insulating layer is formed to cover the gate line and the gate electrode. A semiconductor layer is formed on the gate insulating layer to overlap with the gate electrode. A data line, a source electrode, and a drain electrode are formed on the gate insulating layer and the semiconductor layer. A photoresist layer is formed on the data line, the source electrode, and the drain electrode. The photoresist layer is patterned, and an organic layer is formed on the substrate having the photoresist layer pattern. Then, the photoresist layer pattern is removed.
Public/Granted literature
- US20090209068A1 METHOD OF MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE Public/Granted day:2009-08-20
Information query
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