A socket assembly for electrically connecting an IC package to a printed circuit board, comprises an insulative housing, at least two retainers mounted on the printed circuit board and a loading plate. The insulative housing defines a receiving space for the IC package. The retainers are mounted on the printed circuit board and located on two sides of the insulative housing, and the retainer has a latching portion with a latching slot. The loading plate is mounted above the insulative housing and has two opposite lateral portions retained in the latching slot of the retainer, respectively, to retain the loading plate.