An optoelectronic module having an optoelectronic device with a contact conductor and a connection carrier with a connection area. The contact conductor is electrically conductively and/or thermally conductively connected to the connection area. A local, delimited heating region is formed on the contact conductor or the connection carrier has a cutout, which is at least partly covered by the contact conductor. A method which enables simplified and reliable production of an optoelectronic module is also described.