Invention Grant
- Patent Title: Method for analyzing multi-layer materials from one-sided pulsed thermal imaging
- Patent Title (中): 从单面脉冲热成像分析多层材料的方法
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Application No.: US11452052Application Date: 2006-06-13
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Publication No.: US07769201B2Publication Date: 2010-08-03
- Inventor: Jiangang Sun
- Applicant: Jiangang Sun
- Applicant Address: US IL Chicago
- Assignee: UChicago Argonne, LLC
- Current Assignee: UChicago Argonne, LLC
- Current Assignee Address: US IL Chicago
- Agent Joan Pennington
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method, apparatus, and computer program product provides automated analysis of thermal imaging data for multi-layer materials based upon a theoretical model of a multi-layer material system, which is solved numerically. The computer-implemented method effectively processes the volume heating effect for thermal barrier coatings (TBCs), since quantitative evaluation of TBC thickness and conductivity is particularly important. TBC thickness is a processing parameter and required to be monitored. TBC conductivity is a measure of TBC quality because it is directly related with TBC density/porosity, microcracking and interface cracks. Because this method is an imaging technology, it can be used for fast and 100% area inspection of larger TBC surfaces, such as combustor liners.
Public/Granted literature
- US20070299628A1 Method for analyzing multi-layer materials from one-sided pulsed thermal imaging Public/Granted day:2007-12-27
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