Invention Grant
US07768282B2 Apparatus and method for terminating probe apparatus of semiconductor wafer
有权
用于终止半导体晶片的探针装置的装置和方法
- Patent Title: Apparatus and method for terminating probe apparatus of semiconductor wafer
- Patent Title (中): 用于终止半导体晶片的探针装置的装置和方法
-
Application No.: US12372049Application Date: 2009-02-17
-
Publication No.: US07768282B2Publication Date: 2010-08-03
- Inventor: Bryan J. Root , William A. Funk
- Applicant: Bryan J. Root , William A. Funk
- Applicant Address: US MN Apple Valley
- Assignee: Celadon Systems, Inc.
- Current Assignee: Celadon Systems, Inc.
- Current Assignee Address: US MN Apple Valley
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.
Public/Granted literature
- US20090153166A1 Apparatus and Method for Terminating Probe Apparatus of Semiconductor Wafer Public/Granted day:2009-06-18
Information query