Invention Grant
- Patent Title: Probe assembly for lapping a bar using a patterned probe
- Patent Title (中): 用于使用图案化探针研磨棒的探针组件
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Application No.: US12073174Application Date: 2008-02-29
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Publication No.: US07768281B2Publication Date: 2010-08-03
- Inventor: Ryuji Fujii , Takashi Honda , Hiroyasu Tsuchiya , Koji Hosaka
- Applicant: Ryuji Fujii , Takashi Honda , Hiroyasu Tsuchiya , Koji Hosaka
- Applicant Address: CN Hong Kong
- Assignee: SAE Magnetics (H. K.) Ltd.
- Current Assignee: SAE Magnetics (H. K.) Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2007-055568 20070306
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A probe assembly used to lap a bar, the bar being provided with elements that are to be formed into sliders, is provided. The probe assembly comprises an elastically deflectable probe, and a stopper for applying bending deformation to the probe so as to cause first bending deflection at a leading end of the probe and for maintaining the first bending deflection of the leading end while preventing a bending deformation at the leading end from becoming smaller than the first bending deflection. The leading end of the probe is adapted to be subjected to second bending deflection that is larger than the first bending deflection in a same direction as a direction of the first bending deflection and thereby to abut against an electrode pad to establish electrical connection between the probe and the electrode pad, the electrode pad being provided on a surface of the bar other than a surface to be lapped.
Public/Granted literature
- US20080223155A1 Probe assembly for lapping bar using patterned probe Public/Granted day:2008-09-18
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