A semiconductor device has a semiconductor chip bonded to external connection pads or external connection terminals by flip-chip bonding and an underfill resin, and provides a semiconductor device which enables to lessen the warpage attributable to the underfill without involvement of an increase in the size of the semiconductor device. A low elastic resin member is disposed opposite to a surface of a semiconductor chip on which a plurality of electrode pads are formed, and an underfill resin is filled between the semiconductor chip and the low elastic resin member and between electrode pads and external connection pads.