Invention Grant
- Patent Title: Circuit device and manufacturing method thereof
- Patent Title (中): 电路装置及其制造方法
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Application No.: US11165680Application Date: 2005-06-24
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Publication No.: US07768132B2Publication Date: 2010-08-03
- Inventor: Yusuke Igarashi , Takeshi Nakamura , Yasunori Inoue , Ryosuke Usul , Hideki Mizuhara
- Applicant: Yusuke Igarashi , Takeshi Nakamura , Yasunori Inoue , Ryosuke Usul , Hideki Mizuhara
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JPP2004-193290 20040630
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/04 ; H01L23/10 ; H01L23/34
Abstract:
A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.
Public/Granted literature
- US20060001166A1 Circuit device and manufacturing method thereof Public/Granted day:2006-01-05
Information query
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