Invention Grant
- Patent Title: Multi-chip package system
- Patent Title (中): 多芯片封装系统
-
Application No.: US11326211Application Date: 2006-01-04
-
Publication No.: US07768125B2Publication Date: 2010-08-03
- Inventor: Seng Guan Chow , Heap Hoe Kuan
- Applicant: Seng Guan Chow , Heap Hoe Kuan
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
A chip package system is provided including providing a chip having interconnects provided thereon; forming a molding compound on the chip and encapsulating the interconnects; and forming a recess in the molding compound above the interconnects to expose the interconnects.
Public/Granted literature
- US20070158809A1 Multi-chip package system Public/Granted day:2007-07-12
Information query
IPC分类:
