Invention Grant
- Patent Title: Silicon carbide semiconductor device and manufacturing method therefor
- Patent Title (中): 碳化硅半导体器件及其制造方法
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Application No.: US10581247Application Date: 2004-12-01
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Publication No.: US07768017B2Publication Date: 2010-08-03
- Inventor: Koji Nakayama , Yoshitaka Sugawara , Katsunori Asano , Hidekazu Tsuchida , Isaho Kamata , Toshiyuki Miyanagi , Tomonori Nakamura
- Applicant: Koji Nakayama , Yoshitaka Sugawara , Katsunori Asano , Hidekazu Tsuchida , Isaho Kamata , Toshiyuki Miyanagi , Tomonori Nakamura
- Applicant Address: JP Osaka JP Tokyo
- Assignee: The Kansai Electric Co., Inc.,Central Research Institution of Electrical Power Industry
- Current Assignee: The Kansai Electric Co., Inc.,Central Research Institution of Electrical Power Industry
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: Nixon & Vanderhye, P.C.
- Priority: JP2003-405259 20031203
- International Application: PCT/JP2004/017888 WO 20041201
- International Announcement: WO2005/055323 WO 20050616
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L31/0312

Abstract:
With a view to preventing increases in forward voltage due to a change with the lapse of time of a bipolar semiconductor device using a silicon carbide semiconductor, a buffer layer, a drift layer and other p-type and n-type semiconductor layers are formed on a growth surface, which is given by a surface of a crystal of a silicon carbide semiconductor having an off-angle θ of 8 degrees from a (000-1) carbon surface of the crystal, at a film growth rate having a film-thickness increasing rate per hour h of 10 μm/h, which is three times or more higher than conventional counterparts. The flow rate of silane and propane material gases and dopant gases is largely increased to enhance the film growth rate.
Public/Granted literature
- US20070090370A1 Silicon carbide semiconductor device and manufacturing method therefor Public/Granted day:2007-04-26
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