Invention Grant
US07767985B2 EUV pellicle and method for fabricating semiconductor dies using same
有权
EUV防护薄膜和使用其制造半导体管芯的方法
- Patent Title: EUV pellicle and method for fabricating semiconductor dies using same
- Patent Title (中): EUV防护薄膜和使用其制造半导体管芯的方法
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Application No.: US11646053Application Date: 2006-12-26
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Publication No.: US07767985B2Publication Date: 2010-08-03
- Inventor: Uzodinma Okoroanyanwu , Ryoung-Han Kim
- Applicant: Uzodinma Okoroanyanwu , Ryoung-Han Kim
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Farjami & Farjami LLP
- Main IPC: G03F1/00
- IPC: G03F1/00

Abstract:
According to one exemplary embodiment, an extreme ultraviolet (EUV) pellicle for use with a lithographic mask comprises a carbon nanotube film. The carbon nanotube EUV pellicle can be mounted on the lithographic mask. The carbon nanotube EUV pellicle protects the lithographic mask from contamination by undesirable particles and also prevents the undesirable particles from forming a focused image on the surface of a semiconductor wafer during fabrication; while advantageously, the carbon nanotube pellicle has a high level of EUV light transmittance.
Public/Granted literature
- US20080152873A1 EUV pellicle and method for fabricating semiconductor dies using same Public/Granted day:2008-06-26
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