Invention Grant
- Patent Title: Phase change memory device and method of fabricating the same
- Patent Title (中): 相变存储器件及其制造方法
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Application No.: US11905244Application Date: 2007-09-28
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Publication No.: US07767568B2Publication Date: 2010-08-03
- Inventor: Hyeong-Geun An , Hideki Horii , Jong-Chan Shin , Dong-Ho Ahn , Jun-Soo Bae , Jeong-Hee Park
- Applicant: Hyeong-Geun An , Hideki Horii , Jong-Chan Shin , Dong-Ho Ahn , Jun-Soo Bae , Jeong-Hee Park
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0029280 20070326
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
A phase change memory device and method of manufacturing the same is provided. A first electrode having a first surface is provided on a substrate. A second electrode having a second surface at a different level from the first surface is on the substrate. The second electrode may be spaced apart from the first electrode. A third electrode may be formed corresponding to the first electrode. A fourth electrode may be formed corresponding to the second electrode. A first phase change pattern may be interposed between the first surface and the third electrode. A second phase change pattern may be interposed between the second surface and the fourth electrode. Upper surfaces of the first and second phase change patterns may be on the same plane.
Public/Granted literature
- US20080237566A1 Phase change memory device and method of fabricating the same Public/Granted day:2008-10-02
Information query
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