Invention Grant
- Patent Title: Design structure of an integration circuit and test method of the integrated circuit
- Patent Title (中): 集成电路的设计结构和集成电路的测试方法
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Application No.: US11942977Application Date: 2007-11-20
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Publication No.: US07752586B2Publication Date: 2010-07-06
- Inventor: Toshihiko Yokota
- Applicant: Toshihiko Yokota
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Kerry B. Goodwin; H. Daniel Schnurmann
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A design structure for an integrated circuit which includes: a first flip-flop which is capable of flushing and which operates by using a first clock signal CLK 1; a second flip-flop DFF 2 which operates by using a second clock signal CLK 2, and which is connected to the first flip flop; and a third flip-flop DFF 3 which operates by using the second clock signal CLK 2, and which is connected to the first flip-flop. A test on a path between the first and second flip-flops is carried out in a manner that test data is released and captured on receipt of the clock signal CLK 2 between the second flip-flop DFF 2 and the third flip-flop DFF 3 via the first flip-flop DFF 1, and that the test data is flushed by the first flip-flop DFF 1.
Public/Granted literature
- US20090132973A1 DESIGN STRUCTURE OF AN INTEGRATION CIRCUIT AND TEST METHOD OF THE INTEGRATED CIRCUIT Public/Granted day:2009-05-21
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