Invention Grant
- Patent Title: Film thickness predicting program, recording medium, film thickness predicting apparatus, and film thickness predicting method
- Patent Title (中): 膜厚预测程序，记录介质，膜厚预测装置和膜厚预测方法
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Application No.: US11641025Application Date: 2006-12-19
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Publication No.: US07752579B2Publication Date: 2010-07-06
- Inventor: Daisuke Fukuda
- Applicant: Daisuke Fukuda
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2006-171375 20060621
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L21/66 ; H01L21/20 ; H01L21/311
Abstract:
A film thickness predicting apparatus compares a measurement value of a copper plating formed on wiring grooves of various patterns measured using a TEG and a film thickness of the copper plating calculated based on a plating model and a condition file. The film thickness predicting apparatus then delivers optimal plating model from the comparison result and calculates the film thickness of the copper plating formed on a substrate surface to be designed using the optimal plating model. The film thickness predicting apparatus enables to conduct a highly accurate film thickness predicting simulation.
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