Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US11626574Application Date: 2007-01-24
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Publication No.: US07752512B2Publication Date: 2010-07-06
- Inventor: Itsuo Hidaka
- Applicant: Itsuo Hidaka
- Applicant Address: JP Kanagawa
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-026024 20060202
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
A semiconductor integrated circuit includes: a first circuit having a plurality of scan chains; a second circuit connected with input/output signals of the first circuit; and a third circuit connected with the second circuit through the first circuit. The plurality of scan chains comprises a first scan chain that contains flip-flops whose input/output signals are connected with the second circuit, and a second scan chain that does not contain any flip-flop whose input/output signal is connected with the second circuit. The flip-flops operate as a shift register at a scan path test, and when the third circuit exchanges signals with the second circuit through the flip-flops of the first scan chain, the second scan chain of the first circuit operates as a shift register.
Public/Granted literature
- US20070180340A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2007-08-02
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