Invention Grant
- Patent Title: Wireless-interface module and electronic apparatus
- Patent Title (中): 无线接口模块和电子设备
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Application No.: US11562792Application Date: 2006-11-22
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Publication No.: US07752359B2Publication Date: 2010-07-06
- Inventor: Takuya Ooi
- Applicant: Takuya Ooi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2005-339905 20051125
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F13/12 ; G06F13/38 ; G06F7/38 ; G06F9/00 ; G06F9/44

Abstract:
A wireless-interface module is provided. The wireless-interface module includes a connection unit connected to a standardized connection-terminal unit of a semiconductor device, the semiconductor device having a function of performing internal processing on the basis of a predetermined signal input from the standardized connection-terminal unit. The wireless-interface module also includes a wireless signal-transmission-and-reception unit that transmits and/or receives a wireless signal to and/or from a wireless-interface module provided on the host-device side, where the host device makes the semiconductor device execute internal processing, and a control unit that controls an operation performed by the wireless signal-transmission-and-reception unit and that converts a signal transmitted and/or received between the connection unit and the wireless signal-transmission-and-reception unit.
Public/Granted literature
- US20080201497A1 WIRELESS-INTERFACE MODULE AND ELECTRONIC APPARATUS Public/Granted day:2008-08-21
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