Invention Grant
- Patent Title: High-definition multimedia interface receiver/transmitter chipset
- Patent Title (中): 高清多媒体接口/发射机芯片组
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Application No.: US11953570Application Date: 2007-12-10
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Publication No.: US07752357B2Publication Date: 2010-07-06
- Inventor: Peter Shintani
- Applicant: Peter Shintani
- Applicant Address: JP Tokyo US NJ Park Ridge
- Assignee: Sony Corporation,Sony Electronics Inc.
- Current Assignee: Sony Corporation,Sony Electronics Inc.
- Current Assignee Address: JP Tokyo US NJ Park Ridge
- Agency: Dickstein Shapiro LLP
- Main IPC: G06F3/00
- IPC: G06F3/00 ; H04F1/38

Abstract:
A buffer chip is used to isolate the internal connection between an HDMI receiver chip and a remotely-located HDMI port in a consumer electronic device. In one embodiment, an HDMI receiver/transmitter circuit is coupled to a main processor via an internal bus. The HDMI receiver/transmitter circuit, which includes one or more local HDMI inputs/outputs, is further electrically coupled to an HDMI buffer chip, which is in turn connected to one or more HDMI ports located remotely from the HDMI receiver/transmitter circuit. In one embodiment, the detection and control of the HDMI buffer chip is provided directly by the HDMI receiver/transmitter circuit. In another embodiment, the HDMI buffer chip may be electrically isolated from the device's main processor.
Public/Granted literature
- US20090147135A1 HIGH-DEFINITION MULTIMEDIA INTERFACE RECEIVER/TRANSMITTER CHIPSET Public/Granted day:2009-06-11
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