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US07752000B2 Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion 失效
校准非振动接触电位差测量以检测垂直于传感器运动方向的表面变化

Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion
Abstract:
A method and system for determining the contact potential difference of a wafer surface using a non-vibrating contact potential difference probe and a vibrating contact potential difference probe. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor, integrating and scaling the resulting data, and applying offsets to individual tracks of data to match the integrated scaled data to measurements made using a vibrating contact potential difference sensor.
Abstract(Chinese):

一种使用非振动接触电位差探针和振动接触电位差探针来确定晶片表面的接触电位差的方法和系统。 该方法和系统包括使用非振动接触电位差传感器扫描晶片表面，对结果数据进行积分和缩放，以及将偏移量应用于单独的数据轨迹，以将集成的缩放数据与使用振动接触电位差传感器 。

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