Invention Grant
- Patent Title: Wireless location devices and process of manufacture
- Patent Title (中): 无线定位设备和制造过程
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Application No.: US11708224Application Date: 2007-02-20
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Publication No.: US07751832B2Publication Date: 2010-07-06
- Inventor: Brad J. Bartkowski
- Applicant: Brad J. Bartkowski
- Agency: Harding, Earley, Follmer & Frailey
- Agent John F. A. Earley, III; Frank J. Bonini, Jr.
- Main IPC: H04W24/00
- IPC: H04W24/00

Abstract:
Wireless location device and process of manufacture including a location device for use in an encasement or a shoe, the shoe including a footbed having a first surface, a second surface, and a periphery extending from and connecting the first surface to the second surface, one or more circuit boards, with at least one of the one or more circuit boards being a cellular telecommunications board located within the footbed and connected to the battery, and a cellular antenna located within the footbed and connected to the telecommunications board, all configured to communicate with a cellular network enabling the location device to be located via a cellular network or device based location technology and communicate that location via cellular communication.
Public/Granted literature
- US20080076448A1 Wireless location devices and process of manufacture Public/Granted day:2008-03-27
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