Invention Grant
US07751788B2 Tool-less snap-in modular replaceable keypad for wireless communication device and method of assembling same
失效
用于无线通信设备的无工具插件模块化可更换键盘及其组装方法
- Patent Title: Tool-less snap-in modular replaceable keypad for wireless communication device and method of assembling same
- Patent Title (中): 用于无线通信设备的无工具插件模块化可更换键盘及其组装方法
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Application No.: US11627855Application Date: 2007-01-26
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Publication No.: US07751788B2Publication Date: 2010-07-06
- Inventor: Kazuyoshi R. Otani , Scott H. Plunkett
- Applicant: Kazuyoshi R. Otani , Scott H. Plunkett
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Main IPC: H04B1/18
- IPC: H04B1/18
Abstract:
A wireless communication device includes a wireless communication device housing member, and a modular keypad removably attachable to the wireless communication device housing member without use of a separate tool.
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