Invention Grant
US07751333B2 Method and apparatus to couple a module to a management controller on an interconnect
有权
将模块耦合到互连上的管理控制器的方法和装置
- Patent Title: Method and apparatus to couple a module to a management controller on an interconnect
- Patent Title (中): 将模块耦合到互连上的管理控制器的方法和装置
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Application No.: US11027142Application Date: 2004-12-29
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Publication No.: US07751333B2Publication Date: 2010-07-06
- Inventor: Edoardo Campini , Steven DeNies , Mark Summers , Lawson Guthrie
- Applicant: Edoardo Campini , Steven DeNies , Mark Summers , Lawson Guthrie
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G01R31/08
- IPC: G01R31/08

Abstract:
Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
Public/Granted literature
- US20060140179A1 Method and apparatus to couple a module to a management controller on an interconnect Public/Granted day:2006-06-29
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