Invention Grant
- Patent Title: Technique for cooling a device
- Patent Title (中): 冷却设备的技术
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Application No.: US12192231Application Date: 2008-08-15
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Publication No.: US07751191B2Publication Date: 2010-07-06
- Inventor: Kohichi Kakikawa , Yohichi Matsui , Hiroyuki Takenoshita
- Applicant: Kohichi Kakikawa , Yohichi Matsui , Hiroyuki Takenoshita
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Matthew C. Zehrer
- Priority: JP2007-223142 20070829
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F25B21/02 ; H05K5/00

Abstract:
A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit.
Public/Granted literature
- US20090059518A1 Technique for Cooling a Device Public/Granted day:2009-03-05
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