Invention Grant
- Patent Title: Integrated module for data processing system
- Patent Title (中): 数据处理系统集成模块
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Application No.: US12024394Application Date: 2008-02-01
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Publication No.: US07750459B2Publication Date: 2010-07-06
- Inventor: Bing Dang , John Ulrich Knickerbocker , Cornelia Kang-I Tsang
- Applicant: Bing Dang , John Ulrich Knickerbocker , Cornelia Kang-I Tsang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Agent Anne V. Dougherty
- Main IPC: H01L23/538
- IPC: H01L23/538
Abstract:
An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via the through-silicon vias.
Public/Granted literature
- US20090194864A1 INTEGRATED MODULE FOR DATA PROCESSING SYSTEM Public/Granted day:2009-08-06
Information query
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