Invention Grant
- Patent Title: Stacked synchronous buck converter
- Patent Title (中): 堆叠同步降压转换器
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Application No.: US11857199Application Date: 2007-09-18
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Publication No.: US07750445B2Publication Date: 2010-07-06
- Inventor: Yong Liu , Qiuxiao Qian , Honorio T. Granada, Jr.
- Applicant: Yong Liu , Qiuxiao Qian , Honorio T. Granada, Jr.
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Hiscock & Barclay, LLP
- Agent Thomas R. FitzGerald, Esq.
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A multichip module buck converter 10 has a high side power mosfet 12, a low side power mosfet 22 and a pre-molded leadframe 40 between the two mosfets for connecting the source of mosfet 12 to the drain of mosfet 22. Clips 14, 16, 18 and 26 carry the source, gate and drain terminals of the mosfet from planes parallel but spaced apart to a common plane.
Public/Granted literature
- US20090072359A1 STACKED SYNCHRONOUS BUCK CONVERTER Public/Granted day:2009-03-19
Information query
IPC分类:
