Invention Grant
- Patent Title: Method for manufacturing a magnetic head arm assembly (HAA)
- Patent Title (中): 磁头臂组件（HAA）的制造方法
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Application No.: US11636121Application Date: 2006-12-08
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Publication No.: US07733609B2Publication Date: 2010-06-08
- Inventor: Jeffery L. Wang , Takehiro Kamigama , Chi Hung Yuen , Kai Wu
- Applicant: Jeffery L. Wang , Takehiro Kamigama , Chi Hung Yuen , Kai Wu
- Applicant Address: CN Hong Kong
- Assignee: Sae Magnetics (H.K.) Ltd.
- Current Assignee: Sae Magnetics (H.K.) Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Nixon & Vanderhye P.C.
- Priority: WOPCT/CN01/01643 20011226
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
Public/Granted literature
- US20080002303A1 Method for manufacturing a magnetic head arm assembly (HAA) Public/Granted day:2008-01-03
Information query
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